Electronic insulation materials are mainly used for insulation protection of semiconductor components and their electronic equipment. 1 printed circuit board, that is, copper foil version. The substrate is a resin laminate, which is called a rigid copper-clad foil plate. It is usually made of a resin plate such as epoxy or phenolic. If the substrate is a polymer film or a single-layer heat-resistant glass varnish, it is called a flexible copper-clad plate. Polyester, polyimide, and fluoropolymer films are often used. 2 packaging materials to prevent the influence of external moisture and impurities on the parameters of semiconductor components. Currently, approximately 90% of semiconductor components are packaged in plastic. Epoxy resin and silicone resin are mainly used, followed by phenolic resin, polyester, polybutadiene and the like. 3 Insulation film for semiconductor devices, surface protection film for semiconductor components such as large-size film integrated circuits (including contact coating film, passivation film, moisture-proof and anti-vibration film, α-ray shielding film for preventing soft errors, etc.) and interlayer insulating film . Such as a polyimide-based aromatic heterocyclic polymer.
Characteristics and Advantages
(1) Intelligent control design: adjustable main parameter and secondary parameter automatically according to the weight of door leaves;
(2) Low noise: Special static sound track, integration of motor, worm-gear and retarder.
(3) Anti-clamping function: automatically reverse when meeting barriers;
(4) Unique electronic motor lock: the motor will lock up when the door is forced to open.(controlled by remote or switch)
(5) Tighten force: seal door when closed, power consumption approximately 10W under standby;
(6) Advanced brushless motor(36V,100W) can automatically adopt different heavy door leaves;
(7) Bi-doors inter-locking: one of the door leaves always remains closing;
(8)Safety sensor terminal: sensor stops working when door closed;
(9)Unique coating technology: never rusty;
(10)Easy and convenient to install;
(11)Working Process: when the door leaf closes to the right place, the door leaf will slightly shift to the door frame and the ground. The rubbers on the four sides of the door leaf will completely combine with door frame and ground, which ensures air tightness. When the door is open, the rubbers will separate from door frame and ground, which avoids contraction on the ground.
Technical Specification
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Specification |
Light Duty |
Heavy Duty |
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Rang of the Door |
Single-Leaf |
Double-Leaf |
Single-Leaf |
Double-Leaf |
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Door leaf max weight |
100kg |
100kg x 2 |
200kg |
200kg x 2 |
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Mounting Method |
Surface mounting or built-in mounting |
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Open Width |
700-2000mm |
650-2000mm |
750-2000mm |
650-2000mm |
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Power Supply |
AC 220v ± 10%, 50-60 Hz |
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Opening Speed |
300-500mm/s (adjustable) |
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Closing Speed |
250-550mm/s (adjustable) |
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Creep speed |
30-100mm/s (adjustable) |
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Hold-open time |
0.5-20s (adjustable) |
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Airproof Force (Max.) |
>70N |
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Manual Pushing Force |
<100N |
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Electronic Lock Force |
>800N |
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Power consumption |
150W |
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Ambient temperature |
-20+50 C |
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Technical Details:
(1) Rubber lining sealing technology combined with V groove on the guide rail enables the door completely sealed when the door closed;
(2)Special door body location technology. Semicircular surface beam on the ground matches with the V style groove at the bottom of door leaf, which stop the door from swing and make sure it moves stable and smooth;
(3) The door body decorated with matte stainless steel or spray surface, and on the middle and both sides with sealing stripes to ensure the hermetic effect.
(4)Feet sensor switch applied to avoid contagion;
Stainless Steel Sliding Door,Stainless Steel Bypass Sliding Door,Stainless Steel Interior Sliding Door,Stainless Steel Folding Sliding Door
Shenzhen Hongfa Automatic Door Co., Ltd. , https://www.spiralfastdoor.com